Bhubaneswar: In a landmark development for India’s semiconductor ambitions, Odisha capital is set to host the country’s first advanced 3D glass semiconductor packaging facility, with Chief Minister Mohan Charan Majhi scheduled to lay the foundation stone on Sunday for the Rs 1,943 crore project.
The unit, to be established by Heterogeneous Integration Packaging Solutions Pvt Ltd, marks a significant milestone in introducing cutting-edge chip packaging technology using glass substrates to India. It was approved by the Union Cabinet in 2025 under the India Semiconductor Mission. The new facility is expected to create substantial employment opportunities while positioning Odisha as a key player in advanced electronics manufacturing.
Taking to X, the CM wrote: “Odisha’s industrial landscape is evolving rapidly, no longer anchored solely to traditional sectors, but boldly embracing technology, innovation, and high-value manufacturing. Today marks a landmark moment as we break ground on India’s first Advanced 3D Glass Chip Packaging Unit. This visionary project will unlock significant employment opportunities and firmly establish Odisha as a serious force in advanced electronics manufacturing.”
Majhi further noted that the initiative is backed by the visionary leadership of Prime Minister Narendra Modi and the guidance of Union Minister of Electronics and Information Technology Ashwini Vaishnaw.”…the promise of the Purvodaya vision, Odisha is charting a decisive course toward becoming a hub for next-generation industries, contributing powerfully to the dream of an Atmanirbhar Bharat,” he added.
The groundbreaking ceremony will also be attended by Vaishnaw, state’s Electronics and IT Minister Mukesh Mahaling, senior government officials, industry leaders, investors, and academic representatives.
After arriving in Bhubaneswar, Vaishnaw said: “It is indeed a very important day, a historical day today for Odisha because the semiconductor plant foundation will be done today. It’s very important for Odisha to have a world-class, latest technology industry here. Odisha is now becoming an IT hub. It is becoming an electronics manufacturing hub. It is diversifying from metals and minerals to many new industrial bases.”
The facility at Info Valley-II in Bhubaneswar has been described as a breakthrough that will bring one of the world’s most advanced packaging technologies to the country. It will feature glass interposers with passives and silicon bridges, along with 3D Heterogeneous Integration (3DHI) modules. Planned annual capacity includes approximately 69,600–70,000 glass panel substrates, 50 million assembled units (ATMP), and around 13,200 3DHI modules.
Packaged chips from the plant will cater to high-growth and strategic sectors, including aerospace, defence, artificial intelligence (AI), 5G/6G communications, data centres, high-performance computing and electric vehicles. The project is expected to generate about 2,500 direct and indirect jobs.
Speaking to the media, Additional Chief Secretary, Energy Department, Vishal Dev, said, “It’s a great development for the electronics and semiconductor ecosystem of Odisha. 3DGS is a pioneering company across the world. Its investors include the names of Intel and Lockheed Martin, which are global leaders. So it’s a great development for us, and I’m sure it will pave the way for further investments in the semiconductor sector in Odisha.”
This comes close on the heels of the SiCSem compound semiconductor facility, underscoring the state’s growing role in India’s push toward a robust domestic chip ecosystem.
