Bhubaneswar: In a significant milestone for India’s semiconductor ambitions, Odisha Chief Minister Mohan Majhi on Sunday laid the foundation stone for 3D Glass Solutions Inc. (3DGS)’s advanced chip packaging facility at Info Valley in Bhubaneswar.
The event was attended by Union Electronics and IT Minister Ashwini Vaishnaw and state’s Electronics and IT Minister
Mukesh Mahaling.
Vaishnaw described the occasion as a “historic day” for Odisha, highlighting the state’s transformation into an emerging IT and electronics manufacturing hub. “It is indeed a very important day, a historical day today for Odisha because the semiconductor plant foundation will be done today. Odisha is now becoming an IT hub. It is becoming an electronics manufacturing hub. It is diversifying from metals and minerals to many new industrial bases,” he told reporters.
The project represents India’s first advanced 3D glass semiconductor packaging unit, establishing Odisha as the first state to host both a compound semiconductor fabrication facility and a cutting-edge 3D chip packaging plant based on glass substrates. The vertically integrated unit will focus on heterogeneous integration packaging solutions, bringing “the world’s most advanced packaging technology” to India.
The facility, with an estimated investment of around Rs 1,943 crore, will use “advanced glass substrate technology to package semiconductor chips required for applications such as artificial intelligence, 5G networks, defence systems and data centres”. Planned annual capacity includes approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules. It will create more than 2,500 direct and indirect employment opportunities
The project is expected to strengthen domestic semiconductor capabilities and reduce dependence on imports.
The development followed the Union Cabinet’s approval in 2025 for semiconductor projects in Odisha, including this 3DGS initiative with an investment of around Rs 1,943 crore and SiCSem Private Limited’s compound semiconductor fab in collaboration with UK-based Clas-SiC Wafer Fab Ltd. SiCSem’s unit, which broke ground earlier, which aims to produce India’s first commercial silicon carbide (SiC) devices for power electronics in electric vehicles, renewables, and smart grids.
