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After RIR Power Electronics, SiCSem To Lay Stone For Odisha’s 2nd Semicon Unit On Nov 1

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After RIR Power Electronics, SiCSem To Lay Stone For Odisha’s 2nd Semicon Unit On Nov 1

by OB Bureau
October 26, 2025
in Business, Business and Finance, Odisha
Reading Time: 1 min read
After RIR Power Electronics, SiCSem To Lay Stone For Odisha’s 2nd Semicon Unit On Nov 1
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Bhubaneswar: Odisha is set to further cement its position in India’s semiconductor landscape with SiCSem Pvt Ltd, a subsidiary of Archean Chemical Industries Ltd, all set to lay the foundation stone of the second semiconductor unit in the state on November 1.

The company has been allocated 23 acres of land by Idco to establish a compound semiconductor manufacturing facility at EMC Park, Infovalley, here. SiCSem’s promoters, led by Archean Chemical Industries MD Ranjit Pendurthi, met Chief Minister Mohan Charan Majhi at Semicon India 2025 in Delhi last month to discuss the project’s swift implementation, according to the sources.

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Chief Minister and Union Minister for Electronics and IT, Ashwini Vaishnaw are likely to attend the groundbreaking ceremony.

This is among the two projects approved under the India Semiconductor Mission (ISM) with a silicon carbide manufacturing facility being set up by RIR Power Electronics at the same park, with a total investment of approximately Rs 620 crore.

The SiCSem facility, backed by a Rs 2,067 crore investment, will produce 60,000 SiC wafers annually and package approximately 96 million MOSFETs and diodes, serving key sectors like electric vehicles, renewable energy, and smart grids. It is expected to generate 1,000 direct jobs and numerous indirect jobs through the development of ancillary industries and service networks.

It will position Odisha as an emerging semiconductor manufacturing hub, catalysing the growth of the ESDM ecosystem in the state.

SiCSem has also established SICRIC, a dedicated R&D center at IIT-Bhubaneswar with a Rs 64 crore investment, inaugurated in January during the Utkarsh Odisha conclave to advance SiC technology research.

Additionally, US-based 3D Glass Solutions (3DGS) Inc will set up an advanced packaging and embedded glass substrate unit at the same ESDM park in Info Valley-II with a Rs 1,943 crore investment.

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