Bhubaneswar: In a landmark step towards positioning itself as a global hub for advanced semiconductor manufacturing, Odisha is set to host the groundbreaking ceremony of Heterogenous Integration Packaging Solutions (3D Glass Solutions), India’s first Advanced glass Semiconductor Packaging Unit on Sunday in Bhubaneswar.
The ceremony will be graced by Chief Minister of Odisha Mohan Charan Majhi, in the august presence of Union Minister for Electronics & IT, Government of India, Ashwini Vaishnaw, and Mukesh Mahaling, Minister for Electronics & IT. The event will also witness participation from senior government officials, global industry leaders, investors, and academia.
Officials said this pioneering project marks the arrival of the world’s most advanced chip packaging technology in India, firmly placing Odisha at the forefront of next-generation semiconductor innovation.
Key Highlights of the Project:
First in India: Establishment of the country’s first Glass substrate based Advanced Semiconductor Packaging Unit in Odisha
Cutting-edge Technology: Introduction of advanced 3D Heterogeneous Integration modules
Rapid Progress: Groundbreaking within months of approval by the Union Cabinet, reflecting fast-track implementation
Strategic Investment: Project outlay of approximately ₹1,943 crore
Employment Generation: Creation of around 2,500 direct and indirect jobs
High Capacity: Annual production capacity of 50 million assembled units
Critical Applications: Chips to serve key sectors including aerospace, defence, artificial intelligence, 5G technologies and Data Centres.
This milestone further strengthens Odisha’s semiconductor ecosystem, making it the first state in India to host both a compound semiconductor fabrication unit and an advanced 3D chip packaging facility based on Glass Substrates.
The initiative underscores the Government of Odisha’s commitment to fostering high-tech industries, attracting global investments, and creating a robust innovation-driven economy aligned with the vision of Atmanirbhar Bharat.
