New Delhi/Bhubaneswar: Intel CEO Lip-Bu Tan is expected to visit Odisha later this year for the ground-breaking ceremony of 3D Glass Solutions’ semiconductor plant.
The US chip major-backed 3D Glass semiconductor manufacturing unit in Odisha will be set up by Heterogeneous Integration Packaging Solutions Pvt Ltd, entailing an investment of Rs 1,943 crore with an annual production capacity of 5 crore units. This is the first semiconductor project, which involves personal computer chip maker Intel Corporation, along with other technology partners.
Additionally, Intel-powered PCs SicSem Private is collaborating with UK-based Clas-SiC Wafer Fab to establish India’s first silicon carbide-based compound semiconductor facility in Bhubaneshwar’s InfoValley with an investment of Rs 2,066 crore.
“Chief Minister (Mohan Charan Majhi) was here, and they (SiCSem and 3DGS) have given a commitment to start the unit soon. SiCSem’s ground-breaking will be done next month, and the other company, 3D Glass Solutions (3DGS), they are looking for a date from Intel CEO Lip-Bu Tan. He plans to visit Odisha also. That is when the ground-breaking will happen. Hopefully, in the next two to three months,” Odisha Electronics and IT Department Principal Secretary Vishal Kumar Dev told PTI.
He further stated that RIR Power Electronics has informed the CM that their Rs 618 crore silicon carbide wafer facility is operational, targeting commercial production by March 2026.
To accelerate the state’s growth in the sector, the government recently revised semiconductor policy, offering incentives matching 50% of central government incentives, plus support for engineering students, including Rs 10,000 for studying semiconductors and assistance for commercial chip development.
