Bhubaneswar: The Odisha Cabinet, chaired by Chief Minister Mohan Majhi, on Wednesday approved the second amendment to the Odisha Semiconductor Manufacturing and Fabless Policy-2023, offering a more robust package of incentives and refined provisions for projects in this sector.
“The approved amendment reflects Odisha’s intent to create a globally competitive, investor-friendly semiconductor ecosystem,” said Minister of Electronics & Information Technology Mukesh Mahaling.
According to an official release, the amendment is aimed at enhancing the viability and sustainability of capital-intensive and high-technology semiconductor projects. The changes have been brought in based on stakeholder feedback, national policy trends, and evolving investor expectations.
“It introduces 16 key changes, including special packages for the first few projects in each category, enhanced performance-linked incentives (PLI), relocation support, incentives for semiconductor park developers, and strengthened R&D and skilling provisions,” it said.
Odisha is aiming to become a leading hub for semiconductor and electronics innovation.
The release further stated that the policy has been instrumental in attracting strategic proposals in
compound semiconductors, ATMP (Assembly, Testing, Marking and Packaging) units and fabless design. “Proposals from RIR Power Electronics Ltd, SiCSem Pvt Ltd and Heterogeneous integrated Packaging Systems Pvt Ltd have already been approved and the state continues to receive encouraging interest from investors aligned with the India Semiconductor Mission,” it said.
The amendment aligns with the Odisha Industrial Facilitation Act and IPR 2022, and streamlines regulatory and governance mechanisms. An apex committee, chaired by the Chief Secretary, will oversee the policy implementation and fast track approvals, it added.
