New Delhi/Bhubaneswar: A greenfield electronics manufacturing cluster is being developed in Bhubaneswar at an approved cost of Rs 200 crore, Union Minister for Electronics and Information Technology Ashwini Vaishnaw told the Rajya Sabha on Friday.
“It is projected to attract investment of 1,530 crore and generate 3,000 jobs,” he said while replying to a question by BJD MP Sasmit Patra.
Vaishnaw also listed out the measures taken by the Centre for development of electronics, information technology (IT), semiconductor and digital infrastructure in Odisha. “Under the Semicon India Programme, two units have been approved in Odisha with a total investment of Rs 4,009 crore. These units will work in the field of advanced packaging, embedded glass substrate manufacturing and silicon carbide based fab. The chips produced in these plants will be used in automobiles, aerospace, defence, wireless devices, electric vehicles, data centres and consumer electronics appliances,” he noted
Notably, the Odisha government has identified a 1,000-acre area near the Bhubaneswar airport to establish a greenfield semiconductor and electronics manufacturing cluster, which will house the two new chip manufacturing and assembly units of SicSem and 3D Glass Solutions.
Chief Minister Mohan Charan Majhi laid the foundation stone for the country’s first end-to-end silicon carbide semiconductor production plant with an investment of about Rs 2,000 crore last month. The facility is expected to become operational by 2027-28.
The Union Minister further informed that 11 universities in Odisha have been provided free design tools under the Chips to Start-up programme. National Institute of Electronics and IT (NIELIT) has set up two centres and 35 accredited centres in Odisha. “These centres are functioning at places like Cuttack, Bhubaneswar, Sambalpur and Balasore. Around 25,000 candidates have already received training from these centres,” revealed Vaishnaw.
