Bhubaneswar: The third international conference on ‘Sustainable Energy and Future Electric Transportation’ (SeFeT-2023) of Institute of Electrical and Electronics Engineers (IEEE) concluded at Siksha ‘O’ Anusandhan Deemed to be University (SOA) here on Saturday.
Around 500 engineers, researchers, scientists and academicians from across the world attended the four-day conference. They presented their work, shared experiences and ideas in several electrical and electronics fields.
Participants from the USA, UK, Australia, Singapore, Japan, China, the Netherlands, Taiwan, Qatar and Thailand attended the conference.
Among the subjects discussed at the conference were renewable energy, electric transportation, power electronics, electric drives, control techniques, smart grids, communication protocols, intelligent charging infrastructure and standards.
Biju Patnaik University of Technology (BPUT) Vice-Chancellor Prof. Amiya Kumar Rath, who graced the valedictory programme, said such events boost students’ confidence and help launch their own start-ups while encouraging faculty members to take up research activities.
Prof. Rath expressed satisfaction that SOA had taken up research as its thrust area while and the university was rated highly by National Institutional Ranking Framework (NIRF) and QS rankings.
SOA Vice-Chancellor Prof. Pradipta Kumar Nanda said there’s need for more such conferences as they greatly help and boost confidence of researchers.
Dr Vinod Khadkikar, Professor and IEEE Fellow from Khalifa University, Abu Dhabi, who was the guest of honour, praised SOA for organising the conference.
Dr Khadkikar announced that the next edition of the conference will be held at Hyderabad from July 31 to August 3, 2024.
The first edition was held online while the second was conducted in hybrid mode.
Prof. Renu Sharma, General Chair for SeFeT-2023 and Additional Dean (Student Affairs) of Institute of Technical Education and Research, faculty of engineering of SOA, said the research papers received for the conference will be published in IEEE Xplore.
